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4 edition of Oxynitride gate dielectrics for deep sub-micron MOS devices found in the catalog.

Oxynitride gate dielectrics for deep sub-micron MOS devices

Antoine Khoueir

Oxynitride gate dielectrics for deep sub-micron MOS devices

by Antoine Khoueir

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Published by National Library of Canada in Ottawa .
Written in English


Edition Notes

Thesis (M.A.Sc.) -- University of Toronto, 2000.

SeriesCanadian theses = -- Thèses canadiennes
The Physical Object
FormatMicroform
Pagination1 microfiche : negative. --
ID Numbers
Open LibraryOL19128999M
ISBN 100612541282
OCLC/WorldCa50755044

Yang H; Lucovsky G () Integration of ultrathin ( ∼ nm) RPECVD oxynitride gate dielectrics into dual poly-Si gate submicron CMOSFETs. IEDM Technical Digest, . High-quality oxynitride gate dielectrics have been fabricated by rapid thermal processing of LPCVD SiO/sub 2/ in reactive ambients (NH/sub 3/ and O/sub 2/). The as-deposited CVD oxides of AA in thickness show no early breakdowns. The breakdown distribution becomes tighter, the interface state density is reduced, and the interface endurance property is improved after rapid thermal.

Thin Dielectrics for MOS Gate MOS gate oxides thickness in logic, dynamic memory and non-volatile memory has been scaled to enhance the performance ID ∝ Charge x velocity ∝ Cox (VGS - VT) x velocity ∝ Cox (VGS - VT) x velocity ID € α Coxα Kox xoxL. (Ref: S. Asai, Microelectronics Engg., Sept. ) • Within the next few years gate.   Dielectrics are the materials that do not conduct current in the presence of an electric field. The applications of this material in semiconductor industries are very broad in various capacities. Nowadays, extensive research and development (R&D) are in progress to grow high quality high-k gate dielectrics on semiconductors surface.

4 ta nfo rdU ivesy 48 EE / Gate Dielectric araswat Outline •Scaling issues •Technology •Reliability of SiO2 •Nitrided SiO2 •High k dielectrics MOS Gate Dielectrics ta nfo rdU ivesy 49 EE / Gate Dielectric araswat High-k MOS Gate Dielectrics Historically Cox has been increased by decreasing gate oxide thickness. It can also be increased by using a higher K dielectric. Considerations and characteristics of the deep sub-micron and nanometer MOS, especially the 45nm MOS, their characteristic degradation are the devices used in a design etc. and hence may affect the yield []. Large Field Across Gate Oxide In deep submicron, a large field across a thin oxide causes a trap generation.


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Oxynitride gate dielectrics for deep sub-micron MOS devices by Antoine Khoueir Download PDF EPUB FB2

Oxynitride Gate Dielectrics for Deep Sub-micron MOS Devices Master of Applied Science, Antoine Khoueir Department of Metallurgy and Materials Science University of Toronto ABSTRACT The continuous demand for improved CMOS transistors necessitate smailer device by: 1.

In this paper, we report a new method to fabricate oxynitride/oxide gate dielectrics for MOS devices. This method utilizes a thin layer of oxynitride as a membrane for controlled diffusion of O 2 and oxidation of Si at high temperatures with low thermal budget.

MOS devices made with these oxynitride/oxide structures have interface properties like thermal SiO 2 with a structure resistant to Cited by: 7.

The continuous demand for improved CMOS transistors necessitate smailer device dimensions. The reduction in chip size into the deep sub-micron dimensions opens up new scientific and engineering challenges. One of the most critical material in developing deep sub-micron MOS transistors is high quality ultrathin (a few nm) gate dielectric film.

As the gate dielectric thickness is reduced to. Silicon oxynitride (SiO x N y) has been identified to be a better gate dielectric for replacing SiO 2 in deep submicron MOSFETs and advanced nonvolatile memory devices because of its enhanced. In RB model, since there is no spatial local fluctuation of dielectric permittivity, MOS devices with oxynitride as the gate dielectric will not have significant surface potential fluctuations.

For random mixing of separated SiO 2 and Si 3 N 4 phases, since the dielectric permittivities of SiO 2 and Si 3 N 4 are quite different (see Fig. 21 Cited by: Gate Dielectrics and MOS ULSIs provides necessary and sufficient information for those who wish to know well and go beyond the conventional SiO2 gate dielectric.

The topics particularly focus on dielectric films satisfying the superior quality needed for gate dielectrics even in large-scale integration. adshelp[at] The ADS is operated by the Smithsonian Astrophysical Observatory under NASA Cooperative Agreement NNX16AC86A.

In this letter, we report on the impact of the suppression of boron Oxynitride gate dielectrics for deep sub-micron MOS devices book via nitridation of SiO2 on gate oxide integrity and device reliability.

SiO2 subjected to rapid thermal nitridation in pure nitric oxide (NO) is used to fabricate thin oxynitride gate dielectrics. Both n+ polycrystalline silicon (polysilicon) gated n‐MOS (metal–oxide semiconductor) and p+‐polysilicon gated p.

nm-thick gate oxynitride; and six layers of copper wiring, including oxide (SIO), nitride (SIN), and oxynitride (SION) interlayer dielectrics.

The device is shown in Figure 1. Then, we annealed with D 2, H 2, or N 2 and compared the effects on hot-electron reliability. To clarify the thermal/chemical reactions that occur during the. Gate Oxidation • Need two gate oxide t ox’s – thin for core FET’s & thick for I/O FET’s • Grow 1st oxide, strip oxide for core FET’s, grow 2nd oxide • Gate oxide is really made of silicon oxynitride (SiO xN y) • N content prevents boron penetration from p+ poly to channel in pFET’s • Side benefit – increased e ox.

Phosphorus Diffusion in Silicon Oxide and Oxynitride Gate Dielectrics K. Ellis a and R. Buhrmanz School of Applied and Engineering Physics, Cornell University, Ithaca, New YorkUSA Evidence is presented that silicon oxynitride gate dielectrics suppress phosphorus diffusion, as compared to pure silicon dioxide dielectrics.

silicon-oxynitride layer interface, di erent types of deposition techniques allow certain freedom in this respect. However, deposition techniques have been believed for many years not to be suitable for such a responsible task as the formation of gate dielectrics in MOS devices.

1 Introduction The electrical reliability of gate oxides has become an important issue for the deep submicron metal-oxide-Si (MOS) devices [1,2]. Gate dielectrics grown in N 2 O have excellent electrical characteristics such as a large charge-to-breakdown (Q BD) and considerable reduction in interface state generation (Δ D it) under.

CMOS technology is being scaled to sub μm gate length and to power supply (Vdd) of V for applications of high density at lower active power than achievable with a V V CMOS.

Abstract: A most preferable candidate of gate dielectrics in advanced CMOS to satisfy the requirement of an ITRS roadmap is still SiON, especially for high-performance and low-power devices.

To advance the efficiency of SiON gate dielectrics, the keyword is N-rich. A high nitrogen concentration leads to low leakage current and high immunity to impurity penetration.

Silicon Oxynitride – Si 2 N 2 O. Silicon oxynitride is a film coating that is a compound of silicon, oxygen and nitrogen. This film is deposited on wafers via PECVD, and undergoes a very similar process to silicon nitride, with nitrous oxide gas (N 2 O) introduced to hydrides of nitrogen and silicon (NH 3 & SiH 4) inside a a nitrous oxide precursor leads to fewer hydrogen.

/(95)Z /(95)Z MICROELECTRONIC ENGINEERING ELSEVIER Microelectronic Engineering 28 () Recent Developments in Ultra Thin Oxynitride Gate Dielectrics L. Han, M. Bhat, D. Wristers, H. Wang, and D. Kwong Microelectronics Research Center Department of Electrical and Computer. ly studying nitrided-oxide gate dielectrics, 6),7) and to address these issues caused by boron diffusion, we have tried to replace gate SiO 2 with nitrided-oxide.

Nitrided-oxide gate dielectrics (Gate-NO) have been used for dual-gate CMOSFETs with deep submicron channel lengths because of their high boron blocking ability 8),9) (Figure 1) and hot. A new technique for the formation of high quality ultrathin gate dielectrics is proposed. Gate oxynitride was first grown in N 2 O and then annealed by in-situ rapid thermal NO-nitridation.

This approach has the advantage of providing a tighter nitrogen distribution and a higher nitrogen accumulation at or near the Si--SiO 2 interface than either N 2 O oxynitride or nitridation of SiO 2 in the.

History. The earliest gate dielectric used in a field-effect transistor was silicon dioxide (SiO 2).The silicon and silicon dioxide surface passivation process was developed by Egyptian engineer Mohamed M.

Atalla at Bell Labs during the late s, and then used in the first MOSFETs (metal-oxide-semiconductor field-effect transistors). Silicon dioxide remains the standard gate dielectric in. The significant advantages of reoxidation of NH3-nitrided SiO2 using N2O, as opposed to O2, in a rapid thermal system have been demonstrated.

MOS capacitors with N2O-reoxidised NH3-nitrided SiO2 show improved charge-to-breakdown characteristics and suppressed interface state generation under both injection polarities compared to those with pure SiO2 and O2-reoxidised NH3 .The growth of reliable, high quality gate dielectric in the 10 to 30 nanometer (nm) thickness range is of great importance for implementing VLSI MOS structure in the submicron range.

Thermally grown silicon dioxide films have been the prime gate insulator material used in insulated gate field effect.Gate Dielectrics and MOS ULSIs Principles, Technologies and Applications Series: Springer Series in Electronics and Photonics, Vol.

34 The reader will obtain updated information for not only deep-submicron ULSIs having nanometer-range ultrathin gate- dielectrics but also nitrided oxides from this first book presenting them in detail.